High-Performance Cooling

Cool. Consistent. AI-ready

In the race to scale AI, performance is everything – and that means staying cool under pressure. At STT GDC, our advanced cooling solutions are engineered to support the intense demands of AI workloads, delivering consistent reliability and efficiency across any environment.

Tailored cooling for intelligent workloads

No two AI workloads are alike – and neither are their cooling needs. That’s why we offer hybrid solutions that combine the strengths of air and liquid cooling technologies, giving you the flexibility to tailor your infrastructure.

Whether you are running high-density workloads or scaling across environments, our flexible approach ensures the right balance of performance, efficiency and scalability – built around your unique infrastructure demands.

Explore the different cooling approaches

Click/tap on the interactive diagram to compare air cooling, hybrid cooling, direct-to-chip and immersion liquid cooling – from infrastructure layout to heat removal methods.

Direct-to-chip liquid cooling

For the most demanding AI applications, our direct-to-chip liquid cooling solutions provide unparalleled efficiency. By cooling components at the chip level, we significantly reduce thermal resistance, allowing for higher performance and lower energy consumption. This cutting-edge technology is ideal for organisations looking to push the boundaries of computational power while maintaining energy efficiency.

Air-cooled aisles

Our air-cooled aisles are engineered to maximise airflow and minimise energy consumption. By strategically directing cool air to where it’s needed most, we create an efficient cooling environment that supports high-density deployments. This approach not only enhances performance but also reduces operational costs, allowing your AI applications to run smoothly without overheating.